Welcome to the official website of Shenzhen King Technology Co., Ltd!
ESOS Helpline:0755-83982242

Shenzhen King Technology Co., Ltd

Shenzhen Headquarters

Address: 1701, Building D, Phase 1, Tian'an Yungu Industrial Park, No. 133 Xuegang North Road, Bantian Street, Longgang District, Shenzhen

Phone: 0755-83982242

Contact person: Mr. Chen Contact phone number: 13823266309

Email: admin@kingsemi.com.cn

URL: http://www.kingsemi.com.cn

 

Foshan Office

Address: 2902, Building 17, Poly Central Park, Lunjiao Town, Shunde District, Foshan City

Contact person: Mr. Peng Contact phone number: 18823475530

 

Ningbo Office

Contact person: Mr. Wu Contact phone number: 17727487026

Contact Person:Mr. YangContact phone number: 17722548176

To meet the demands of new applications, we have launched low capacity DDR3 SDRAM memory

Article source: King TechnologyPopularity:4655Publication time:2020-04-17

Nowadays, information electronic devices are constantly developing towards lightweight and energy-saving. In order to ensure smooth operation of the overall system, the memory used in such devices should also have characteristics such as high speed, low power consumption, and miniaturization. The leading niche memory manufacturer fully understands the needs of customers and has launched a low capacity 512Mb DDR3/3L SDRAM memory on the market. In addition to its streamlined capacity and 1600Mbps high speed, this new product can also meet the strict working temperature requirements of industrial specifications ranging from -40 ℃ to 105 ℃. In addition, with years of in-depth understanding and experience in various applications, and through good design, this product has been endowed with extremely high compatibility and stability, demonstrating excellent performance. It can be widely used in various consumer and industrial platforms such as SSDs, network communications, printers, energy equipment, etc.

This product has two I/O interfaces and packaging types to choose from: x8 FBGA-78 and x16 FBGA-96, all of which comply with ROHS and JGPSSI specifications. In addition to packaging, we also provide professional services for customers using KGD (Known Good Die). From the development planning stage, we have fully considered the various technical requirements for customers to use KGD in SiP (System in Package) packaging, and have adopted thoughtful designs such as one side edge pads, which not only improve customer convenience but also reduce costs.

Facing increasingly diverse market requirements and application differences, terminal systems often need to adopt more flexible designs and select memory with appropriate capacity, speed, and operating voltage to match. With a complete range of dynamic random access memory, portable memory, and flash memory products, they can meet customers' needs. Through a professional engineering team and the operation of our own 12 inch wafer fab, we ensure high product quality and sufficient production capacity, providing a complete and highly competitive solution.